WACU.S2A.01 Cleaving-Tool
Precise Wafer Cleaving in Crystal Direction
Highest Precision for the Semiconductor Industry
The Wafer Cutter S2A is our fully automated cleaving tool, developed for precise cleaving of wafers in the crystal direction. It meets the highest requirements in semiconductor manufacturing and is designed for cleanroom operation.
- Dimensions
- 800 x 800 x 600 mm (W x D x H)
- Installation
- Table-mounted device, horizontally aligned
- Wafer Sizes
- 150 mm (6"), 200 mm (8"), 300 mm (12")
- Wafer Thickness
- 0.5 - 1.0 mm
- Power Supply
- 230 V, 50/60 Hz
- Connections
- 3x IEC connectors
- Control System
- Embedded PC with servo drives
- Imaging
- Microscope camera with USB connection
Your Benefits at a Glance
Universal Configurability
• Suitable for 6", 8" and 12" wafers
• Wafer thickness range: 0.5 to 1.0 mm
• Interchangeable components for quick changeover
• Automatic wafer size detection
Fully Automated Process
• Computer-controlled crystal alignment
• Automatic cleaving process after alignment
• Microscope camera for precise positioning
• Servo-controlled movement sequences
Cleanroom Compatible
• Designed for cleanroom use
• Minimal particle generation
• Operating temperature: 22°C ±5°C
• Relative humidity: 5% - 60% non-condensing
Intelligent Control
• Integrated control PC with display
• Intuitive user interface
• Adjustable cleaving parameters via XML configuration
• Servo control for precise movements
Functional Principle
The WACU.S2A splits wafers precisely along their crystal direction through an innovative process:
1. Wafer Loading: Wafer is placed in the catching element
2. Crystal Alignment: Automatic alignment via microscope camera
3. Scoring: Precise scoring with the cleaving wheel
4. Cleaving Process: Controlled breaking along the crystal plane
5. Removal: Both wafer halves can be removed